With the gradual development of the LED lighting market, flip-chip LED products undoubtedly have a huge market space, and in the production process of these flip-chip products, the selection of flip-chip accessories is also crucial.
Qian Xuexing, general manager of Morning Technology, revealed to Gaogong LED that “the cost of solder paste in the auxiliary materials is negligible, probably less than 1%. The process cost is the lowest on the market, and it has successfully replaced the past solid glue, but The market share in the entire flip-chip market is still relatively low, mainly in the field of flip-chip COB."
Insiders pointed out that in the LED packaging market, flip-chip will be a trend, but now the market share of flip-chip is indeed very low, the problem is undoubtedly the cost control.
It is true that the application of solder paste in flip-chip devices has attracted much attention from companies. For LED package products, packaging materials and package structures are the main factors affecting their performance.
"The requirements of future LED packaging devices will gradually develop in the direction of high integration, cost reduction and high reliability." Lin Jin, chairman of Xuyu Optoelectronics, added to Gaogong LED.
According to Qin Shengyu, executive deputy general manager of Liyang Optoelectronics, "The company's flip-chip EMC series uses imported EMC brackets and uses internationally advanced 3D automatic printing technology to realize flip-chip packaging."
The application of flip chip on the EMC bracket platform breaks the tradition, transforms the traditional dressing method into a gold-free flip-chip method, and introduces a world-class fully automated production line, achieving high product production efficiency, low device cost and reliability. High performance, long service life and easy application.
Hongli Optoelectronics has successfully achieved breakthroughs in PCT materials and EMC material flip-chip technology, and achieved mass production of fully automated flip-chip products, entering a new era of SMD flip-chip.
Indeed, with the deepening of high-power LEDs in semiconductor lighting applications, LED packaging technology is becoming more and more powerful and integrated.
Qin Shengyu said, "At the beginning of product development, the market positioning of FE30/FE35 has been very clear, replacing traditional 1W imitation lumen products, upgrading flat EMC 3030 products, ceramic substrate 3030/3535 products, replacing similar XPG series products, Enter the market with superior stability and cost-effectiveness."
Due to the different solid crystal method, FE30/FE35 series products with solder paste solid crystal are 10 times of the hot channel of traditional dressing products, which effectively solves the problem of heat conduction of the light source, makes the product hot passage smoother and greatly improves the service life.
According to industry insiders, "the market can not be opened, not the problem of solder paste technology, but the cost of flip-chip, the largest proportion of cost may be flip chip. For the current situation of LED, if the cost is too high, it is very Hard to replace the original process."
According to the survey, the current flip chip products on the market are mainly provided by the new century, crystal power, and Guanghong in Taiwan, and foreign manufacturers such as Europe, Japan, Japan and South Korea also have small shipments. Domestic chip manufacturers, including Dehao Runda and Huacan Optoelectronics, have also gradually increased the mass production of flip-chips in the past two years.
Mo Qingwei, vice president of DHL's chip business unit, believes that in the next 1-2 years, flip-chip COB will gradually be applied from high-power outdoor and industrial COB, and medium- and high-power commercial lighting has also begun.
"At present, Huacan Optoelectronics core products in addition to the main layout in the display, backlight and lighting three areas, flip, CSP and other new product lines have also made rapid breakthroughs." Hua Can Optoelectronics Vice President Bian Difei mentioned.
LED flip chip combines the advantages of pre-loaded chips and vertical chips, and has broad application prospects in general lighting, automotive, high-power lighting, large-size backlights, projectors, flashlights and other fields.
In short, due to the good heat dissipation of the flip chip, high reliability, and ability to withstand high current drive, it has a high cost performance, and has become the mainstream of the development of the LED industry in the past two years.
According to Liu Lin, deputy general manager of the same party, “At present, the same party photoelectric is very optimistic about the flip-chip market, it will also be the focus of the company's next development.â€
"From the current technology point of view, compared with the formal wear, the light effect is almost the same, but the cost of flipping is slightly higher. I believe that with the large-volume entry of flip chip manufacturers, the price will inevitably drop sharply. The chip will gradually be like a chip.†Liu Lin mentioned to the Gaogong LED reporter that “the company’s current sales of COB has accounted for 30% of the total COB, and the storage volume is large, and the prospects are good.â€
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